2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)

2023年IEEE第27届信号和电源完整性研讨会（SPI）

Important Dates：

Full Paper Submission:  February 10th, 2023

Notification of Acceptance：March 15th, 2023

Paper Submission Deadline：April 5th, 2023

Date of the meeting：May 07-10, 2023

Location：Aveiro, Portuga

Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation.

In view of previous years success, the Committees are hardworking and keen on the 27th Edition which will be held as an in-person event in Aveiro, Portugal. The technical program will include both oral and poster sessions, and several prominent experts will be giving keynotes on areas of emerging interest.

Organizing Committee:

Workshop Chairs

Joana Catarina Mendes
Instituto de Telecomunicações, Aveiro (POR)

Stefano Grivet-Talocia
Politecnico di Torino, Torino (ITA)

Program Chairs

Antonio Maffucci
University of Cassino and Southern Lazio, Cassino (ITA)

Pedro Fonseca
Instituto de Telecomunicações, Aveiro (POR)

Standing Committee

Uwe Arz
Physikalisch-Technische Bundesanstalt, Braunschweig (GER)

Antonio Maffucci
University of Cassino and Southern Lazio, Cassino (ITA)

Flavio G. Canavero
Politecnico di Torino, Torino (ITA)
 
Hartmut Grabinski
Leibniz University Hannover, Hannover (GER)
 
Stefano Grivet-Talocia
Politecnico di Torino, Torino (ITA)

Michel S. Nakhla
Carleton University, Ottawa (CAN)
 
José E. Schutt-Ainé
University of Illinois, Urbana-Champaign (USA)
 
Madhavan Swaminathan
Georgia Institute of Technology, Atlanta (USA)

Call for Papers:

• Modeling and simulation for SI/PI
• Coupled signal and power Integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/ sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design

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